Amid the COVID-19 crisis, the global 3D IC and 2.5D IC Packaging Market estimated at USD 86.8 Billion in the year 2020, is projected to reach a revised size of USD 730 Billion by 2027, growing at a CAGR of 35.9% over the analysis period 2020-2027. 3D IC is a type of metal oxide semiconductor…
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USHBU MAQOLADAN NIMA OLISH KERAK:
- 8 yilda 2020 milliard, 730 yilga kelib 2027 CAGRda o'sib, qayta ko'rib chiqilgan hajmi 35 milliard dollarga yetishi kutilmoqda.
- 3D IC is a type of metal oxide semiconductor….
- Amid the COVID-19 crisis, the global 3D IC and 2.
